All Products
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive.
| Materials: | Epoxy Resin |
|---|---|
| Color: | Clear |
| Thermal Conductivity: | 0.3 |
Two-component High Hardness Black Epoxy Resin Potting Adhesive Electronic Devices Electronic Components Epoxy Resin Potting
| Materials: | Epoxy Resin |
|---|---|
| Color: | Black |
| Thermal Conductivity: | 0.3 |
Two-component High thermal conductivity Epoxy potting of electronic component
| Materials: | Epoxy Resin |
|---|---|
| Color: | Black |
| Thermal Conductivity: | 0.3 |
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting
| Materials: | Epoxy Resin |
|---|---|
| Color: | Black |
| Thermal Conductivity: | 0.3 |
Two-component High thermal conductivity Epoxy potting of electronic component
| Materials: | Epoxy Resin |
|---|---|
| Color: | Black |
| Thermal Conductivity: | 0.3 |
Two-component solventless room temperature curing epoxy potting-sealing material Compound
| Materials: | Epoxy Resin |
|---|---|
| Color: | Black |
| Thermal Conductivity: | 0.3 |
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