Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting

Place of Origin China
Brand Name Maxtech
Certification SGS,FDA,ISO
Model Number Ep3113
Minimum Order Quantity 100kg
Packaging Details 25kg per Drum
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 100000000

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Product Details
Materials Epoxy Resin Color Black
Thermal Conductivity 0.3 Part Two Part
Name Epoxy Potting Sealant Usage Elelctronic Component
Samples Free Sample Delivery Time 7-10days
Certificate SGS, ISO ,FDA Application Encapsulating And Potting Of Flame Retardant
Advantage High Quality & Competitive Price ODM & OEM Yeah
Shelf Life 12 Months
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Product Description
We Supply Free Samples. OEM & ODM are Welcomed. we can do your logo and Brand
High temperature resistant potting Two-component solventless room temperature curing epoxy potting-sealing material Compound
Specification
Test items Test criteria Units MDEP 3113 A EP 3113 B
Exterior Eye survey --- Black slurry Colorless or light yellow clear liquid
Viscosity GB/T 2794-2022 25℃,mPa·s 27,000±7,000 20±5
Density GB/T 13354-1992 25℃,g/cm3 2.40±0.05 0.95±0.05
Mixing ratio Mass ratio Ratio=A:B 100:8
Mixing initial viscosity GB/T 13354-1992 25℃,mPa·s 2,000±500
Operating time GB/T 13354-1992 25℃,min 60±20
Gel time GB/T 13354-1992 60℃,min 60
Hardness GB/T 531.1-2008 Shore D 90±5
Thermal conductivity GB/T 10297-2015 W/mK 0.9-1.0
Coefficient of expansion GB/T 20673-2006 μm/(m,℃) 20
Glass transition temperature DSC 95
Shear strength GB/T 7124-2008

Mpa,Fe-Fe

Mpa,Al-Al

 

≥4

≥8

 

Dielectric strength GB/T 1693-2007 kV/mm(25℃) ≥18
Loss factor GB/T 1693-2007 (1MHz)(25℃) 0.09
Dielectric constant GB/T 1693-2007 (1MHz)(25℃) 2.9
Volume Resistance GB/T 1692-2008 DC500V,Ω· cm 1.00E +15
Use temperature GBT 20028-2005 -50--180
 
 
 
Product Description
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 0
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 1
Description

EP 3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material, suitable for motors, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product packaging protection, and has excellent adhesion and temperature resistance.

Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 2
Typical Applications
  • Power module, high voltage DC contactor
  • Permanent magnet motor stator, high voltage power supply
  • Tank type reactor, high voltage capacitor
  • Power tools, instruments and other packaging protection
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 3
Key Features

 

  • Excellent adhesion and cracking resistance
  • Low CTE linear expansion coefficient
  • High thermal conductivity
  • Excellent electrical insulation and stability
  • It can be used for a long time at 150℃-180℃
  • Water absorption is very low, good water and moisture resistance
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 4
Packing Specification
*
  • EP 3113 High temperature resistant potting

    Order Code:A: 2KEP6172; B: 2KEP6173

  • Components A and B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods); The storage period is one year.
  • Component A :20kg/ plastic drum; Component B :0.8kg or 2.4kg/ pot
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 5
Transport &Storage
● When stored at or below25°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance. It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
Operation process
Operation Matters

* Component A needs to be stirred evenly in the original package before use (precipitation may occur after a long time, and the performance will not be affected after the use of stirring evenly).
* Affected by temperature, there are certain differences in the curing speed of glue in different seasons, and the curing time is longer in winter. All of the above glues can be heated to accelerate curing. You can also choose to use MAXTECH winter formula.

* The A and B components of some products may crystallize and caking under low temperature conditions, which is a normal
phenomenon; Before use, put it in the oven at 80℃ to melt it, and put it to room temperature for normal use, without affecting the properties of the glue.
* During the mixing process, pay attention to the glue on the inner wall of the container and stir it back to ensure the uniformity of mixing.

Use the process

* Gluing: Stir the glue component A fully in the original package, take the A and B components according to the specified mass ratio (see the table above), mix and stir well, and then potting and sealing. The operating time after mixing is shown in the table above. After the operating time is exceeded, the glue will become sticky and no longer suitable for pouring. Therefore,the amount of glue should not be too much each time to avoid waste.
* Curing: curing conditions refer to the table above. The curing speed of glue is related to temperature, and the higher the temperature, the shorter the curing time. In winter, the temperature is low, the curing time will be extended, can be heated curing method, heating for 2 hours under the condition of 80℃. The glue can be assembled after curing and hardening. It is recommended to proceed to the next step after curing for 24 hours.
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 6
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 7
Junction box silicone gel
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 8
One Part Silicone Sealant of electronic component
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 9
Thermal Conductivity Silicone Potting Sealant
Company Profile
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 10
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 11
Our Advantages
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 12
Certifications
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 13
Exhibition
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 14
Packing & Delivery
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 15
FAQ
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 16
Q:How long can I get a quote
A:The quotation can be provided no longer than 24hours on condition that we know all detailed requirement.

Q:Do you accept private Label?
A:Yes. ODM & OEM are Welcome.

Q:Can I get a samle before order?
A: Of course. Generally, we provide 1-3 pieces free samples for quality testing and the courier fee be born by customers. Thanks for your understanding.

Q:Do you have MOQ.
A:Yes, Generally ,MOQ is 1000pcs or 1000kg.

Q: How long will finished my order?
A: It’s depend on your order quantity.
Generally, Our production time is 10-15 days after get the payment.

Q:How to find the suitable sealant?
A: Please let me know your application purpose,substrate, application method and all your requirements. We would like give you a better recommendation.
 
As our suggestions of the sealant choose:
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their
characteristics. The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors.
Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications. 1. Silicone Potting Compounds
are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting
compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between
-40°C and 200°C. 2. Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical
resistance and have better adhesion to a wide variety of substrates and typically do not need primers. 3. Polyurethane Potting
Compounds generally have better flexibility, elongation, and abrasion resistance. 4. Acrylic Potting Compounds are UV and
heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 17
Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 18
Max Tech Do the PU , Silicone, MS, Epoxy
For Automotive , Construction and Electronic Industry.We also do related tools, machines & accessories.

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Ep3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material,High temperature resistant potting 19