Two-component High thermal conductivity Epoxy potting of electronic component

Place of Origin China
Brand Name Maxtech
Certification SGS,FDA,ISO
Model Number Ep3115(2#)
Minimum Order Quantity 100kg
Packaging Details 25kg per Drum
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 100000000

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Product Details
Materials Epoxy Resin Color Black
Thermal Conductivity 0.3 Part Two Part
Name Epoxy Potting Sealant Usage Elelctronic Component
Samples Free Sample Delivery Time 7-10days
Certificate SGS, ISO ,FDA Application Encapsulating And Potting Of Flame Retardant
Advantage High Quality & Competitive Price ODM & OEM Yeah
Shelf Life 12 Months
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Product Description
We Supply Free Samples. OEM & ODM are Welcomed. we can do your logo and Brand
Two-component solventless room temperature curing epoxy potting-sealing material Compound
Specification
T
Test items Test criteria Units EP 3115(2#) A EP 3115(2#) B
Color Eye test --- Black liquid Light yellow liquid
Viscosity GB/T 2794-2022 25℃,mPa·s 40,000±8,000 40±20
Density GB/T 13354-1992 25℃,g/cm3 2.6±0.1 0.95±0.05
Mixing ratio Mass ratio Ratio=A:B 100:5
Mixing viscosity GB/T 2794-2022 25℃,mPa·s 6,000±1,500
Operating time GB/T 2794-2022 25℃ , min 80±15
Hardness GB/T 531.1-2008 Shore D,25℃ 90±5
Thermal conductivity GB/T 10297-1998 W/mK 1.5
Coefficient of expansion GB/T 20673-2006 μm/(m,℃)

25, < Tg

62, > Tg

Glass transition temperature GB/T 22567-2008

95, 80℃* 3h;

105, 120℃* 2h;

 

105, curing 120°C 2hr;

Shear strength GB/T 7124-2008

Mpa,Fe/Fe AI/AI

 

≥10 ≥8

 

Dielectric strength GB/T 1843-2008 kV/mm(25℃) ≥18
Dielectric loss GB/T 1693-2007 (1MHz)(25℃) 0.09
Dielectric constant GB/T 1693-2007 (1MHz)(25℃) 3.1
Volume resistance GB/T 1693-2007 DC500V,Ω·cm 1.00E +15
Service temperature GBT 20028-2005 -50-200
 
 
Product Description
Two-component High thermal conductivity Epoxy potting of electronic component 0
Two-component High thermal conductivity Epoxy potting of electronic component 1
Description

EP 3115(2#)A/B is a two-component solvent-free environmental curing epoxy potting-sealing material that can also be cured by temperature. It is suitable for the packaging and protection of motors, automotive electronics, power tools, reactors, meters and other products with high thermal conductivity requirements, and has excellent adhesion and temperature resistance.

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Typical Applications
●For encapsulating and potting of flame retardant for small and medium-sized and closing of the circuit board, such as capacitor coating, solid state relay potting, etc.
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Key Features

 

  • Excellent adhesion, cracking resistance
  • Low CTE linear expansion coefficient
  • Has high thermal conductivity 1.5W/M.K.
  • Excellent electrical insulation and stability
  • It is used in the temperature range of -50℃-200℃
  • Water absorption is very low, good water and moisture resistance
  •  
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Packing Specification
*
  • Code: A:2KEP3080, B:2KEP3081
  • Components A and B should be protected from light, heat and sealed (can be transported and stored as non-dangerous goods); The storage period is one year.
  • A Component :10kg/ plastic bucket; B Component: 0.5kg/ can.
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Transport &Storage
● When stored at or below25°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance. It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
Operation process
Operation Matters

* Component A needs to be stirred evenly in the original package before use (precipitation may occur after a long time, and the performance will not be affected after the use of stirring evenly).
* Affected by temperature, there are certain differences in the curing speed of glue in different seasons, and the curing time is longer in winter. All of the above glues can be heated to accelerate curing. You can also choose to use MAXTECH winter formula.

* The A and B components of some products may crystallize and caking under low temperature conditions, which is a normal
phenomenon; Before use, put it in the oven at 80℃ to melt it, and put it to room temperature for normal use, without affecting the properties of the glue.
* During the mixing process, pay attention to the glue on the inner wall of the container and stir it back to ensure the uniformity of mixing.

Use the process

* Gluing: Stir the glue component A fully in the original package, take the A and B components according to the specified mass ratio (see the table above), mix and stir well, and then potting and sealing. The operating time after mixing is shown in the table above. After the operating time is exceeded, the glue will become sticky and no longer suitable for pouring. Therefore,the amount of glue should not be too much each time to avoid waste.
* Curing: curing conditions refer to the table above. The curing speed of glue is related to temperature, and the higher the temperature, the shorter the curing time. In winter, the temperature is low, the curing time will be extended, can be heated curing method, heating for 2 hours under the condition of 80℃. The glue can be assembled after curing and hardening. It is recommended to proceed to the next step after curing for 24 hours.
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Two-component High thermal conductivity Epoxy potting of electronic component 7
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Company Profile
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Two-component High thermal conductivity Epoxy potting of electronic component 11
Our Advantages
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Certifications
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Exhibition
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Packing & Delivery
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FAQ
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Q:How long can I get a quote
A:The quotation can be provided no longer than 24hours on condition that we know all detailed requirement.

Q:Do you accept private Label?
A:Yes. ODM & OEM are Welcome.

Q:Can I get a samle before order?
A: Of course. Generally, we provide 1-3 pieces free samples for quality testing and the courier fee be born by customers. Thanks for your understanding.

Q:Do you have MOQ.
A:Yes, Generally ,MOQ is 1000pcs or 1000kg.

Q: How long will finished my order?
A: It’s depend on your order quantity.
Generally, Our production time is 10-15 days after get the payment.

Q:How to find the suitable sealant?
A: Please let me know your application purpose,substrate, application method and all your requirements. We would like give you a better recommendation.
 
As our suggestions of the sealant choose:
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their
characteristics. The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors.
Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications. 1. Silicone Potting Compounds
are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting
compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between
-40°C and 200°C. 2. Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical
resistance and have better adhesion to a wide variety of substrates and typically do not need primers. 3. Polyurethane Potting
Compounds generally have better flexibility, elongation, and abrasion resistance. 4. Acrylic Potting Compounds are UV and
heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
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Max Tech Do the PU , Silicone, MS, Epoxy
For Automotive , Construction and Electronic Industry.We also do related tools, machines & accessories.

For More Information

Welcome to talk more with us.

Have a nice day.
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