EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive.

Place of Origin China
Brand Name Maxtech
Certification SGS,FDA,ISO
Model Number Ep3108
Minimum Order Quantity 100kg
Packaging Details 25kg per Drum
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 100000000

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Product Details
Materials Epoxy Resin Color Clear
Thermal Conductivity 0.3 Part Two Part
Name Epoxy Potting Sealant Usage Elelctronic Component
Samples Free Sample Delivery Time 7-10days
Certificate SGS, ISO ,FDA Application Encapsulating And Potting Of Flame Retardant
Advantage High Quality & Competitive Price ODM & OEM Yeah
Shelf Life 12 Months
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Product Description
We Supply Free Samples. OEM & ODM are Welcomed. we can do your logo and Brand

EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive.Specification

General performance

Testing Items Units EP 3108
A B
Appearance --- Colorless or light yellow clear liquid

Colorless and clear

Liquid

Viscosity

mPa·s,

25℃

440±50 100±20
Density G/cm3, 25 ℃ 1.12±0.05 1.02±0.05
 

Operation process

Item Units or conditions MDEP 3108
Mix ratio Weight ratio 100:50
Mixing viscosity mPa·s,25℃ 200-300
Mix density g/cm3,25℃ 1.08
Operating time (1) Hr,25℃ 1
Curing time ℃/hr 80/1 or 25/24

Typical properties

Items Testing Criteria Units 3108
Colors Eye tests -- Colorless and transparent
Hardness GB/T 531.1-2008 ShoreD 75±5
Shear strength GB/T 7124-2008 Mpa, Fe-Fe ≥7
Thermal conductivity GB/T 10297-1998 W/mK 0.27
Coefficient of expansion GB/T 20673-2006 μm/ (m, ° C) 65
Water absorption GB/T 8810-2005 24h, 25 ° C, % <0.1
Dielectric strength GB/T 1693-2007 kV/mm (25 ° C) >20
Loss factor GB/T 1693-2007 (1MHz) (25 ° C) 0.014
Dielectric constant GB/T 1693-2007 (1MHz) (25 ° C) 3.53
Volume resistance GB/T 1692-92 (DC500V) Ω· cm 1.2×1015
 
Product Description
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 0
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 1
Description

EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. This two-component epoxy adhesive is designed for potting, protecting electronic products that require high strength or confidentiality.

The EP3108 series of epoxy potting adhesives cure without heat. After thoroughly mixing component A and component B by weight ratio, the product cures within a certain time to form protection.

EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 2
Typical Applications
  • Suitable for hard light strip, display module, photoelectric sensor, smart water meter and other photoelectric display devices and products
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 3
Key Features

 

  • This product is a transparent color epoxy potting material
  • Resistant to moisture, dirt and other atmospheric components
  • High strength, excellent adhesion, cracking resistance, toughness
  • With secret acting, no solvent, no curing byproducts
  • Stable mechanical and electrical properties at -45-90℃
  •  

EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 4
Packing Specification
*
  • EP 3108 transparent epoxy Potting adhesive, order code: A: 2KEP6110; B: 2KEP6111

  • Component A: 10kg/ pot
  • Component B: 5kg/ pot
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 5
Transport &Storage
● When stored at or below25°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance. It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
Operation process
Operation Matters

* Component A needs to be stirred evenly in the original package before use (precipitation may occur after a long time, and the performance will not be affected after the use of stirring evenly).
* Affected by temperature, there are certain differences in the curing speed of glue in different seasons, and the curing time is longer in winter. All of the above glues can be heated to accelerate curing. You can also choose to use MAXTECH winter formula.

* The A and B components of some products may crystallize and caking under low temperature conditions, which is a normal
phenomenon; Before use, put it in the oven at 80℃ to melt it, and put it to room temperature for normal use, without affecting the properties of the glue.
* During the mixing process, pay attention to the glue on the inner wall of the container and stir it back to ensure the uniformity of mixing.

Use the process

* Gluing: Stir the glue component A fully in the original package, take the A and B components according to the specified mass ratio (see the table above), mix and stir well, and then potting and sealing. The operating time after mixing is shown in the table above. After the operating time is exceeded, the glue will become sticky and no longer suitable for pouring. Therefore,the amount of glue should not be too much each time to avoid waste.
* Curing: curing conditions refer to the table above. The curing speed of glue is related to temperature, and the higher the temperature, the shorter the curing time. In winter, the temperature is low, the curing time will be extended, can be heated curing method, heating for 2 hours under the condition of 80℃. The glue can be assembled after curing and hardening. It is recommended to proceed to the next step after curing for 24 hours.
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 6
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 7
Junction box silicone gel
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 8
One Part Silicone Sealant of electronic component
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 9
Thermal Conductivity Silicone Potting Sealant
Company Profile
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 10
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 11
Our Advantages
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 12
Certifications
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 13
Exhibition
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 14
Packing & Delivery
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 15
FAQ
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 16
Q:How long can I get a quote
A:The quotation can be provided no longer than 24hours on condition that we know all detailed requirement.

Q:Do you accept private Label?
A:Yes. ODM & OEM are Welcome.

Q:Can I get a samle before order?
A: Of course. Generally, we provide 1-3 pieces free samples for quality testing and the courier fee be born by customers. Thanks for your understanding.

Q:Do you have MOQ.
A:Yes, Generally ,MOQ is 1000pcs or 1000kg.

Q: How long will finished my order?
A: It’s depend on your order quantity.
Generally, Our production time is 10-15 days after get the payment.

Q:How to find the suitable sealant?
A: Please let me know your application purpose,substrate, application method and all your requirements. We would like give you a better recommendation.
 
As our suggestions of the sealant choose:
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their
characteristics. The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors.
Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications. 1. Silicone Potting Compounds
are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting
compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between
-40°C and 200°C. 2. Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical
resistance and have better adhesion to a wide variety of substrates and typically do not need primers. 3. Polyurethane Potting
Compounds generally have better flexibility, elongation, and abrasion resistance. 4. Acrylic Potting Compounds are UV and
heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 17
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 18
Max Tech Do the PU , Silicone, MS, Epoxy
For Automotive , Construction and Electronic Industry.We also do related tools, machines & accessories.

For More Information

Welcome to talk more with us.

Have a nice day.
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. 19